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Inside 1969, in the event the company, which had set up its company simply locally, arrive at export for the United states, DISCO was used the very first time for easy pronunciation getting the newest initials of one’s business term.
So it name in addition to consisted of the intent in order to with ease guess whatever you addressed as the “disk” inside the English and you can “disco” inside Foreign-language each other express the form of your own blade or grinding wheel. Initially, DISCO was applied only while the label of one’s Us part, nevertheless the name of one’s headquarters is technically changed to DISCO Corporation in the 1977.
Recently Set up Die Separator to possess Hard Materials For example SiC
- Simultaneously, information that have highest physical strength such as SiC wafers that are widely used to own electricity products and you can sapphire wafers employed for Added cannot be separated just by extension.
- Integration of an array of engineering process – mechanical, electric, physics, chemical compounds, and advice running – supplies high worth-additional semiconductors.
- On the DISCO DISCO is a great semiconductor gadgets brand giving accuracy processing gizmos, and dicing saws and you may grinders, and reliability handling equipment (knives and you will rims) used in creation semiconductors and you may electronic components.
- At the moment, most of DISCO issues were brought to the semiconductor design techniques associated with extremely cutting-edge technology from a huge selection of organizations in different forms.
In the DISCO DISCO are a semiconductor devices name brand that provide accuracy handling products, in addition to dicing saws and grinders, and you may precision processing products (knives and you will wheels) useful for design semiconductors and you will digital components. At the moment, most of DISCO issues were brought on the semiconductor production techniques related to very advanced innovation of hundreds of organizations in numerous versions. Consolidation from a wide range of technologies techniques – mechanized, electronic, physics, chemical compounds, and you can information handling – provides extremely high well worth-added semiconductors. The following explains the fresh jobs one DISCO servers play on the semiconductor design process. DISCO is actually to start with a knife/grinding controls brand name within the label from Dai-Ichi Seitosho CO., Ltd.
Bringing distant research to help you comfy coping with complex ‘Kiru’, ‘Kezuru’, ‘Migaku’ innovation
DDS2020 are a perish separator one to achieves break up of tough materials such as SiC and you can sapphire that have the lowest load playing with a good the fresh cracking mechanism.
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Covert dicingTM is actually an excellent dicing process in which a changed covering is actually molded by the paying attention an excellent beam of light in the workpiece, following the which be concerned are used on the outside to split up they on the perish. Since the silicone wafers will be separated having a fairly touch from stress, the brand new pass away will likely be broke up by broadening the brand new dicing recording. Concurrently, material that have highest physical power including SiC wafers that will be widely used to have energy gizmos and sapphire wafers used in Added cannot be split by expansion.